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6th IEEE International Conference
on  Knowledge Innovation and Invention 2023

July 21-23, 2023

Sapporo, Hokkaido, Japan

This is a Hybrid (In-person and virtual) conference. To present oral or poster papers virtually, please select "Online Presentation" in the registration system.

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撰寫吸引標題

6th IEEE International Conference on

Knowledge Innovation and Invention 2023

Call for Paper

Sapporo ,Hokkaido ,Japan

URL: http://www.ickii.org/

Email: ickii.office@gmail.com

 

 

Organized by:

Institute of Electrical and Electronics Engineers (IEEE)

International Institute of Knowledge Innovation and Invention (IIKII)

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6th IEEE International Conference on Knowledge Innovation and Invention 2023 (IEEE ICKII 2023) will be held in Sapporo ,Hokkaido ,Japan on July 21-23, 2023, and it will provide a unified communication platform for researchers in the topics of information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering, material science and other related fields. Professional practice in the information, innovation, communication, and engineering fields are welcome to participate in IEEE ICKII 2023. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities.

The conference proceedings will be submitted to the IEEE Xplore® digital library if the papers fit the scopes of IEEE (IEEE fields). Papers of other fields will be sent to Scopus for reviewed and indexed. To maintain a high quality of conference proceedings, the English of full papers should be good enough. We will request authors to send the full papers for English editing if the papers do not pass the review process by the Program Committees.

 

Excellent papers selected from IEEE ICKII 2023 will be recommended to be published on suitable 12 different SSCI, SCI and Scopus journals after an additional review process and need extra publication charge.   

 

1. Journal of Clinical Medicine (SCI; ISSN 2077-0383; IF: 4.241)

2. Sustainability (SCI and SSCI; ISSN 2071-1050; IF: 3.251)

3. Materials (SCI; ISSN 1996-1944; IF: 3.623)

4. Coatings (SCI; ISSN 2079-6412; IF: 2.881)

5. Electronics (SCI: ISSN: 2079-9292​; IF: 2.397)

6. Applied Sciences  (SCI; ISSN 2076-3417; IF: 2.679)

7. Symmetry (SCI; ISSN 2073-8994; IF: 2.713)

8. Sensors (SCI; ISSN 1424-8220; IF: 3.576)

9. Water (SCI; ISSN 2073-4441; IF: 3.103)

10. Energies (SCI; ISSN 1996-1073; IF: 3.004)

11. Sensors and Materials (SCI; ISSN: 0914-4935; IF: 0.599)

12. Applied System Innovation  (ESCI, Scopus, ISSN 2571-5577)

(1) Artificial Intelligence

(2) Human-Computer Interaction          

(3) Control and Systems Engineering

(4) Information Systems

(5) Medical Informatics and Healthcare Engineering

(6) Industrial and Manufacturing Engineering

(7) Applied Systems on Educational Innovations and Emerging Technologies

(8) Applied Mathematics

 

IIKII journals (publication charge free)

(1) Applied Functional Materials (ISSN: 2737-5323)

(2) Educational Innovations and Emerging Technologies (ISSN: 2737-5315)

(3) International Journal of Clinical Medicine and Bioengineering (ISSN: 2737-534X)

(4) International Journal of Environmental Sustainability and Protection (ISSN: 2737-5447)

(5) International Journal of Social Sciences and Artistic Innovations (ISSN: 2737-5293)

(6) International Journal of Business Studies and Innovation (ISSN:2737-5331)

(7) Innovation on Design and Culture (ISSN: 2810-9279)

 

 

If authors submit full papers to the above 7 IIKII journals with accepted for publication by the journals, each submission will be given USD $100 refund on conference registration fee.

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