5th IEEE International Conference
on  Knowledge Innovation and Invention 2022
 
ICKII 2022 Call for Paper
National Dong Hwa University, Hualien, Taiwan, July 22-24, 2022
 
Organized by:
National Dong Hwa University, Hualien, Taiwan
IEEE Tainan Section Sensors Council(IEEE TSSC)
International Institute of Knowledge Innovation and Invention (IIKII)
 

5th International Conference on Knowledge Innovation and Invention 2022 (ICKII 2022) will be held in National Dong Hwa University, Hualien, Taiwan on July 22-24, 2022, and it will provide a unified communication platform for researchers in the topics of information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering, material science and other related fields. Professional practice in the information, innovation, communication, and engineering fields are welcome to participate in ICKII 2022. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities.

The conference proceedings will be submitted to the IEEE Xplore® digital library if the papers fit the scopes of IEEE (IEEE fields). Papers of other fields will be sent to Scopus for reviewed and indexed. To maintain a high quality of conference proceedings, the English of full papers should be good enough. We will request authors to send the full papers for English editing if the papers do not pass the review process by the Program Committees.

Excellent papers selected from ICKII 2022 will be recommended to be published on suitable 12 different SSCI, SCI and Scopus journals after an additional review process and need extra publication charge.   

 (1) Journal of Clinical Medicine (SCI; ISSN 2077-0383; IF: 4.241)

(2) Sustainability (SCI and SSCI; ISSN 2071-1050; IF: 3.251)

(3) Materials (SCI; ISSN 1996-1944; IF: 3.623)

(4) Coatings (SCI; ISSN 2079-6412; IF: 2.881)

(5) Electronics (SCI: ISSN: 2079-9292​; IF: 2.397)

(6) Applied Sciences  (SCI; ISSN 2076-3417; IF: 2.679)

(7) Symmetry (SCI; ISSN 2073-8994; IF: 2.713)

(8) Micromachines (SCI; ISSN 2072-666X; IF: 2.891)

(9) Water (SCI; ISSN 2073-4441; IF: 3.103)

(10) Modern Physics Letters B (SCI; ISSN 1793-6640; IF: 1.224)

(11) Sensors and Materials (SCI; ISSN: 0914-4935; IF: 0.599)

(12) Applied System Innovation  (ESCI, Scopus, ISSN 2571-5577)

 

IIKII journals (publication charge free)

(1) Applied Functional Materials (ISSN: 2737-5323)

(2) Educational Innovations and Emerging Technologies (ISSN: 2737-5315)

(3) International Journal of Clinical Medicine and Bioengineering (ISSN: 2737-534X)

(4) International Journal of Environmental Sustainability and Protection (ISSN: 2737-5447)

(5) International Journal of Social Sciences and Artistic Innovations (ISSN: 2737-5293)

(6) International Journal of Business Studies and Innovation (ISSN:2737-5331)

If authors submit full papers to the above 6 IIKII journals with accepted for publication by the journals, each submission will be given USD $200 refund on conference registration fee.